เครื่องทดสอบการยึดเกาะ High Performance Bonding Model : PTR-1101
โพสต์เมื่อ : 18 มี.ค 2563 เวลา 10:55 น.
PTR-1101
• Available for pull, push, peel and shear tester for wire bonding, TCP(TAB), GCA, Flip Chip, SMT substrate and PCB
• Touch-up function (Japanese patent 1682513) for shear test, which measurement can start from a designated height over a sample board
• Indirect, not direct, bonding through low melting-point solder for probe-heating BGA pull test
• Independent function of the main unit such as condition setting, display of measured results, and print output(option)
• Simultaneous and efficient display of up to four data-analysis windows