Quadrioalpha1

Quadrioalpha1
High Volume Plasma System : QUADRIOα

  • Quadrioα is a compact standalone plasma cleaning system suitable for substrates with a strip form factor.
  • Capable of performing PE and RIE processes, the Quadrioα provides high uniformity reliable results with a competitive throughput.
  • A dry vacuum pump contained in the body of the machine.
  • An anti-jam system that protects the substrates, with automatic recovery function.
  • Throughput capability is measured with 10 sec plasma time. 
  • Organic decontamination and surface activation of lead frames prior to wire bonding.
  • Adhesion promoter prior to molding.
  • Adhesion promoter of die attach materials on lead frames or PBGA strips.
  • Adhesion promoter for flip chip packages prior to underfill.
  • Flux removal from semiconductor packages or hybrids.
  • General activation, cleaning and decontamination.